Product Overview
This Module is a SOC single-chip solution based on Loongson 2K1500 processor. It is a Mini Module(84mmx55mm) with PICMG COM Express specification and COM Express Type10 pin pin definition. Module adopts 2K1500 processor, dual-core maximum frequency 1.1GHz(TDP), standard on-board 2GB DDR3 memory particles (optional 4GB), on-board 8GB EMMC (maximum support 128GB), the module adopts domestic component design
The COM-E port on the module supports two Gigabit network ports (Gbe1 provides one RGMII). Four PCI-E2.0x1 (one PCI-E2.0x4 is optional), one PCI-E2.0x4 is optional (two PCI-E2.0x1 is optional, one supports PCIe EP mode). 1 SATA3.0,6 CAN ports,12 TTL serial ports (of which 8 serial ports are multiplexed with LIO interface),4 USB2.0 ports,1 USB2.0 OTG,22 GPIO and 2 independent SPI (one of which supports two chip options); Typical power consumption of the module is 5W.
This product adopts full table attached design, with stable, safe, reliable, practical and other characteristics, can be widely used in national defense, government, scientific research, medical, numerical control, communication, transportation and other fields
Product Features
COM-Express Mini module, size 84*55mm;
Processor: Loongson 2K1500 dual-core processor, maximum frequency 1.1GHz;
Memory: on-board 2GB DDR3 industrial-grade domestic memory particles, optional 4GB;
Storage: onboard 8GB EMMC, optional maximum 128GB;
Network: two on-board Gigabit network ports, one RGMII is optional for network port Gbe1.
PCI-E: four PCI-E2.0x1 (one PCI-E2.0x4 is optional), one PCI-E2.0x4 is optional (two PCI-E2.0x1 is optional, one supports PCIe EP mode).
SATA: one SATA3.0 port, supporting 6Gbps transmission.
USB: four USB2.0 ports, one USB2.0 OTG;
two independent SPIs, one of which supports two slice selection, supporting a total of three SPIs and three I2C.
six CAN2.0 ports;
4 GPI interfaces,4 GPO interfaces,14 GPIOs;
12V or 5V power supply, support wide voltage 4.5V~16V power supply, automatic start;
Localization: Components 100percent localization.
Product specifications
Project |
Description |
|
Processor/Chipset |
CPU |
Loongson 2K1500 |
Audit number |
2 nuclei |
|
Main frequency |
1.1G Hz (TDP, subject to the final release of the original factory) |
|
Memory |
Type |
Onboard DDR 3 |
Capacity |
Standard with 2 GB , optional 4GB |
|
Store |
FLASH |
OnboardSPI NOR FLASH,Capacity16MB |
EMMC |
Standard with8GB,可选128GB |
|
Expansion interface |
USB |
Four USB2.0 hosts and one USB2.0 OTG |
SATA |
One SATA3.0 port |
|
PCIE |
The default is 1 PCI-E2.0x4 (PCIE-- --) 0 ) and 4-way PCI-E2.0x1 (PCIE1); 6-- is optional Lu P CI-E2.0 x 1 or 2 way P CI-E2.0x4; PCIE1 Optionally set this parameter to EP Mode ; |
|
RGMII |
2 A gigabit network connection Mouth , Gbe1 provides one RGMII. |
|
串Mouth/ Local Bus接Mouth |
默认12路TTL串Mouth,1路为调试串Mouth; Eight of them 串Mouth Optional L ocal Bus Bus Reuse , support FPGA expansion |
|
I 2 C |
Supports 3 channels Independence I2C |
|
SPI |
2 路IndependenceSPI,其中1路支持2个片选,可接3个外设 |
|
CAN |
6 way CAN2.0 |
|
SDIO |
One SDIO, four GPI, two GPO-- by default |
|
RTC |
Supports external RTC |
|
GPIO |
Standard with22个GPIO（含SDIO引脚ReuseGPIO） |
|
Power supply |
Power-on Mode |
AT mode: The call starts automatically. |
Input voltage |
Typical DC12V or DC5V, the input range is 4.5V to 16V |
|
Power consumption |
5W（典型Power consumption） |
|
Physical parameters |
Size (W×D) |
84mm × 55mm （ Module) |
Environmental adaptability |
Wide temperature level |
Operating temperature ：-20 ℃ ～ 60 ℃, 5 to 95percent RH, non-condensing |
Store温度 ： - 4 0 ℃ ～ 75 ℃, 5 to 95percent RH, non-condensing |
||
Industrial grade |
Operating temperature ：-40 ℃ ～ 70 ℃, 5 to 95percent RH, non-condensing |
|
Store温度 ： - 55 ℃ ～ 80 ℃, 5 to 95percent RH, non-condensing |
||
